Packaging Design Product List and Ranking from 4 Manufacturers, Suppliers and Companies

[Packaging Design] Packaging design using 3D CAD

Using 3DCAD, we will design packaging such as cardboard, plastic sheets, and cushioning materials according to your requirements. Please leave the packaging design to JBL.

Our company uses 3D CAD for packaging design, tailoring designs for cardboard, plastic sheets, cushioning materials, and more to meet our customers' requests. By utilizing 3D data of the products, we can simultaneously advance product development and packaging design, thereby shortening the product development period for our customers. Additionally, from the early stages of product design, we can quickly understand logistics costs, workability, and packaging material costs, such as loading efficiency onto trucks and storage efficiency in warehouses. If you are interested in packaging design and packaging testing, please contact us at the information below. ◆◆ Contact person: 0466-41-0262 (Ishii) / 0466-41-0265 (Kitagawa) / 0466-41-0267 (Omata) ◆◆

Company：日本ビジネスロジスティクス（JBL）藤沢北事業所
Price：Other

Packaging materials

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Create packaging in original sizes and shapes! Packaging design

For events! We can accommodate your desired size and shape!

We sell large-sized Christmas trees made from recyclable reinforced cardboard. We also design and create custom sizes according to your requests, and our mini trees for workshops are ideal for children's events and activities. *For more details, please refer to the PDF document or feel free to contact us.

Company：富士木材
Price：Other

Other packaging materials

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Packaging design time-saving technology

Significant time reduction and accurate buffer design will be possible!

Tohoku Ueno will assist you in reducing costs through packaging design. By converting the process of measuring physical items to data input, significant time savings can be achieved. Additionally, by reading actual product data, accurate cushioning design becomes possible. 【Features】 ■ Assistance in cost reduction through packaging design ■ Packaging design utilizing simulation technology ■ Faster packaging design through reverse engineering technology ■ Significant time savings possible ■ Accurate cushioning design possible *For more details, please refer to the external link or feel free to contact us.

Company：東北ウエノ
Price：Other

Circuit board design and manufacturing

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What are the factors behind packaging cargo accidents? Free explanatory materials on basic knowledge provided.

In Japan, most of the damage to transported cargo is caused by dynamic stress!

There are not a few cases where damage occurs during the distribution process of packaged goods until they arrive at their destination. Among the damages to transported goods within Japan, a significant portion, accounting for 77%, is caused by dynamic stress believed to result from substantial external forces applied to packaged goods, such as "breakage, bending, denting, and deformation." To reduce the risk of damage to packaging and products during the general distribution process (both domestic and international) and to improve product reliability, it is important to conduct packaging tests in advance to confirm the appropriateness of packaging specifications and the strength of the products themselves. *For detailed information, please refer to the attached PDF document. For more information, feel free to contact us.*

Company：日本ビジネスロジスティクス（JBL）藤沢北事業所
Price：Other

Packaging Contract

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[Information] President's Blog January 2021

The breadth of technology that can handle the deployment of development results as services and even packaging design for semiconductor products is featured!

This document summarizes the president's blog of Wave Technology Co., Ltd., a "development design promotion business" that addresses the shortage of engineers, from January 5, 2021, to January 27, 2021. It introduces entries such as "Review of Last Year (2) - Service Development of Development Results" from January 15, 2021, "How WTI's Wireless Power Transfer Technology Was Developed!" from January 20, 2021, and "The Relationship Between Global Warming Countermeasures and Inverters" from January 27, 2021. Please take a moment to read it. [Contents (Excerpt)] ■ January 5, 2021: Review of Last Year - Recognition and Exposure of Our Company on Media and the Web ■ January 15, 2021: Review of Last Year (2) - Service Development of Development Results ■ January 20, 2021: How WTI's Wireless Power Transfer Technology Was Developed! - An interview article with a university professor: From the start of development to the current service provision, and thoughts for the future without reservation. *For more details, please refer to the PDF document or feel free to contact us.

Company：Wave Technology
Price：Other

Other contract services
Embedded system design service
Circuit board design and manufacturing

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